Electronic component, oscillator, electronic apparatus, and moving object

ABSTRACT

An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/841,994, filed Sep. 1, 2015, which claims priority to Japanese PatentApplication No. 2014-177810, filed Sep. 2, 2014, the disclosures ofwhich are expressly incorporated by reference herein in theirentireties.

BACKGROUND

1. Technical Field

The present invention relates to an electronic component, an oscillator,an electronic apparatus, and a moving object.

2. Related Art

In the related art, in order to obtain a stable frequency in the fieldof communication apparatuses, an electronic component including anoscillation circuit that outputs a signal at a desired frequency using aresonator element formed from a piezoelectric body such as quartzcrystal is used. In order to reduce a frequency variation that occurswhen the electronic component is mounted on a mounting board due to theinfluence of a wiring pattern of the mounting board and a component orcircuit disposed in the vicinity of the electronic component, anelectronic component has been proposed in which a conductor layer isprovided in a substrate of the electronic component. For example, asdescribed in JP-A-2001-177346, a piezoelectric oscillator is disclosedin which a shielding conductive film is formed between amounting surfaceand a resonant circuit portion that determines the oscillation frequencyof an oscillation circuit.

However, according to the electronic component (piezoelectricoscillator) having the configuration described in JP-A-2001-177346, afrequency variation that occurs when the electronic component is mountedon the mounting board is reduced, but the value of the electrostaticcapacitance formed between a wiring pattern provided on the mountingsurface of the substrate of the electronic component and the conductorlayer provided in the substrate is increased. This increase inelectrostatic capacitance value causes an insufficient negativeresistance of the oscillation circuit, which may result in unstableoscillation characteristics of the oscillation circuit.

SUMMARY

An advantage of some aspects of the invention is to solve at least apart of the problems described above, and the invention can beimplemented as the following forms or application examples.

APPLICATION EXAMPLE 1

An electronic component according to this application example includes:an oscillation circuit that is electrically connected to a resonatorelement; and a substrate that includes a first surface on which theoscillation circuit and wiring that is electrically connected with theresonator element and the oscillation circuit to form an oscillationloop are disposed, and a second surface opposite to the first surface,wherein the substrate includes a conductor layer between the firstsurface and the second surface, the conductor layer overlaps the wiringin a plan view, and a distance between the wiring and the conductorlayer in a thickness direction as a direction along a directionintersecting the first surface and the second surface is from 0.35 mm to0.7 mm.

According to this application example, the electronic component includesthe substrate and the oscillation circuit, and functions as anoscillator by connecting with the resonator element formed from, forexample, a piezoelectric body such as quartz crystal. The substrateincludes the conductor layer between the first surface and the secondsurface opposite to the first surface. The wiring that is connected withthe resonator element and the oscillation circuit to form theoscillation loop is disposed on the first surface of the substrate.Since the wiring and the conductor layer overlap each other in the planview, the electrostatic capacitance value corresponding to the distancebetween the wiring and the conductor layer in the thickness direction(direction intersecting the first surface and the second surface) isformed between the wiring and the conductor layer. In the electroniccomponent, the distance between the wiring and the conductor layer isset to 0.35 mm or more in order to reduce the electrostatic capacitancevalue between the wiring and the conductor layer to a predeterminedvalue or less. With this configuration, the value of the electrostaticcapacitance formed between the wiring and the conductor layer isstabilized in the electronic component, for example, an oscillator, andit is possible to reduce the possibility of a reduction in the absolutevalue of the negative resistance of the oscillation circuit. Therefore,it is possible to reduce the possibility of a deterioration in thecharacteristics, for example, oscillation stability of the oscillator.Hence, it is possible to provide the electronic component in which thepossibility of a deterioration in oscillation stability is reduced.Moreover, by setting the distance between the wiring and the conductorlayer to 0.7 mm or less, the electronic component has a general heightor less as an electronic component, which can contribute tominiaturization.

APPLICATION EXAMPLE 2

An electronic component according to this application example includes:an oscillation circuit that is electrically connected to a resonatorelement; and a substrate that includes a first surface on which theoscillation circuit and wiring that is electrically connected with theresonator element and the oscillation circuit to form an oscillationloop are disposed, and a second surface opposite to the first surface,wherein the substrate includes a conductor layer between the firstsurface and the second surface, the conductor layer overlaps the wiringin a plan view, and an electrostatic capacitance value between thewiring and the conductor layer is from 0.6 pF to 0.8 pF.

According to this application example, the electronic component includesthe substrate and the oscillation circuit, and functions as anoscillator by connecting with the resonator element formed from, forexample, a piezoelectric body such as quartz crystal. The substrateincludes the conductor layer between the first surface and the secondsurface opposite to the first surface. The wiring that is connected withthe resonator element and the oscillation circuit to form theoscillation loop is disposed on the first surface of the substrate.Since the wiring and the conductor layer overlap each other in the planview, the electrostatic capacitance value corresponding to the distancebetween the wiring and the conductor layer is formed between the wiringand the conductor layer. In the electronic component, the electrostaticcapacitance value between the wiring and the conductor layer is set to0.8 pF or less. With this configuration, the value of the electrostaticcapacitance formed between the wiring and the conductor layer isstabilized in the electronic component, for example, an oscillator, andit is possible to reduce the possibility of a reduction in the absolutevalue of the negative resistance of the oscillation circuit. Therefore,it is possible to reduce the possibility of a deterioration in thecharacteristics, for example, oscillation stability of the oscillator.Moreover, since the electrostatic capacitance value between the wiringand the conductor layer is set to 0.6 pF or more, it is not necessary toincrease the distance between the wiring and the conductor layer morethan necessary. The electronic component can be contained in apredetermined height. Hence, it is possible to provide the electroniccomponent in which the possibility of a deterioration in oscillationstability is reduced.

APPLICATION EXAMPLE 3 and APPLICATION EXAMPLE 4

In the electronic component according to the application exampledescribed above, it is preferable that the substrate has a relativedielectric constant of from 9 to 10.

According to these application examples, the substrate with a relativedielectric constant of from 9 to 10 is used for the electroniccomponent. As the material of the substrate with a relative dielectricconstant of from 9 to 10, for example, alumina (Al₂O₃) ceramic can beused. Since ceramic has high rigidity and a low thermal expansion rate,it is possible to provide the electronic component with high reliabilityby using ceramic for the substrate.

APPLICATION EXAMPLE 5 and APPLICATION EXAMPLE 6

In the electronic component according to the application exampledescribed above, it is preferable that the wiring has an area of from1.65 mm² to 2.0 mm².

According to these application examples, the wiring having an area offrom 1.65 mm² to 2.0 mm² is provided on the substrate of the electroniccomponent. By setting the total area of the wiring to 1.65 mm² or more,it is possible to provide the wiring for forming the oscillation loopand land patterns of components to be mounted on the wiring. By settingthe total area of the wiring to 2.0 mm² or less, it is possible toconfigure the substrate in which the electrostatic capacitance valuebetween the wiring and the conductor layer is 0.8 pF (predeterminedvalue) or less.

APPLICATION EXAMPLE 7 and APPLICATION EXAMPLE 8

In the electronic component according to the application exampledescribed above, it is preferable that the electronic component furtherincludes an electronic element, and that the electronic element isdisposed on the first surface, connected to the wiring, and overlaps theconductor layer in the plan view.

According to these application examples, the electronic componentincludes the electronic element, such as a passive element including aresistor, a capacitor, and an inductor, or an active element including asemiconductor element, which adjusts, for example, the characteristicsof the resonator element, the oscillation circuit, or the like. Sincethe electronic element is provided at a position overlapping theconductor layer in the plan view, an influence due to the wiring patternof the mounting board and a component or the like disposed in thevicinity of the electronic component when the electronic component ismounted on the mounting board is reduced, and thus the value of theelectrostatic capacitance formed between the electronic element and theconductor layer is stabilized. With this configuration, it is possibleto reduce a variation in characteristics as the electronic componentbefore and after the mounting of the electronic component on themounting board.

APPLICATION EXAMPLE 9 and APPLICATION EXAMPLE 10

In the electronic component according to the application exampledescribed above, it is preferable that the electronic element is aninductor.

According to these application example, the electronic componentincludes, as the electronic element, the inductor that widens afrequency variable range within which a frequency at which the resonatorelement connected with the electronic component oscillates is variable,and enhances the linearity of the variable range. With thisconfiguration, since the value of the electrostatic capacitance formedbetween the inductor and the conductor layer is stabilized, it ispossible to reduce a variation in frequency variable range width beforeand after the mounting of the electronic component on the mountingboard.

APPLICATION EXAMPLE 11 and APPLICATION EXAMPLE 12

In the electronic component according to the application exampledescribed above, it is preferable that the conductor layer is grounded.

According to these application example, since the conductor layer isgrounded, the voltage level of the conductor layer becomes constant.With this configuration, the influence due to the wiring pattern of themounting board and a component or the like disposed in the vicinity ofthe electronic component when the electronic component is mounted on themounting board is reduced, and thus the value of the electrostaticcapacitance formed between the wiring and the conductor layer isstabilized. Therefore, it is possible to reduce a characteristicvariation, for example, a frequency variation before and after themounting of the electronic component on the mounting board.

APPLICATION EXAMPLE 13 and APPLICATION EXAMPLE 14

An oscillator according to each of these application examples includes:the electronic component according to the application example describedabove; and the resonator element.

According to these application examples, since the oscillator includesthe electronic component capable of obtaining stable oscillationcharacteristics and the resonator element that oscillates by connectingwith the electronic component, it is possible to provide the oscillatorcapable of obtaining stable oscillation characteristics.

APPLICATION EXAMPLE 15 and APPLICATION EXAMPLE 16

In the oscillator according to the application example described above,it is preferable that the resonator element overlaps the conductor layerin a plan view.

According to these application examples, since the resonator element isprovided at a position overlapping the conductor layer in the plan view,an influence due to a wiring pattern of a mounting board and a componentor the like disposed in the vicinity of the oscillator when theoscillator is mounted on the mounting board is reduced, and thus thevalue of the electrostatic capacitance formed between the resonatorelement and the conductor layer is stabilized. With this configuration,it is possible to reduce a characteristic variation, for example, afrequency variation before and after the mounting of the oscillator onthe mounting board.

APPLICATION EXAMPLE 17 and APPLICATION EXAMPLE 18

An electronic apparatus according to each of these application examplesincludes the electronic component according to the application exampledescribed above.

According to these application example, since the electronic apparatusincludes the electronic component capable of obtaining stableoscillation characteristics, it is possible to provide the electronicapparatus controlled by stable oscillation characteristics and thus withhigh reliability.

APPLICATION EXAMPLE 19 and APPLICATION EXAMPLE 20

A moving object according to each of these application examples includesthe electronic component according to the application example.

According to these application examples, since the moving objectincludes the electronic component capable of obtaining stableoscillation characteristics, it is possible to provide the moving objectcontrolled by stable oscillation characteristics and thus with highreliability.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a schematic plan view showing a schematic configuration of anoscillator according to Embodiment 1.

FIG. 2 is a cross-sectional view taken along the line A-A in FIG. 1.

FIG. 3 is a graph showing the relation between a distance between wiringand a conductor layer and an electrostatic capacitance value.

FIGS. 4A and 4B are diagrams showing an oscillation circuit as oneexample for explaining a negative resistance and an equivalent circuitof the oscillation circuit.

FIG. 5 is a diagram showing a circuit configuration of the oscillator.

FIG. 6 is a table showing the relation among the distance between thewiring and the conductor layer, oscillation characteristics, and afrequency variable width.

FIG. 7 is a schematic plan view showing a schematic configuration of anelectronic component according to Embodiment 2.

FIG. 8 is a cross-sectional view taken along the line C-C in FIG. 7.

FIG. 9 is a perspective view showing a configuration of a mobile (ornotebook) personal computer as an electronic apparatus including theelectronic component.

FIG. 10 is a perspective view showing a mobile phone as an electronicapparatus including the electronic component.

FIG. 11 is a perspective view showing a digital camera as an electronicapparatus including the electronic component.

FIG. 12 is a perspective view showing an automobile as a moving objectincluding the electronic component.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, embodiments of the invention will be described withreference to the drawings. In the drawings below, the scales of layersor members are different from actual ones so that the layers or membershave a recognizable size.

Moreover, in FIGS. 1, 2, 7, and 8, an X-axis, a Y-axis, and a Z-axis areshown as three axes orthogonal to one another for convenience ofdescription, in which the head side of each arrow indicating the axialdirection is defined as “positive side” and the tail side is defined as“negative side”. In the following, a direction parallel to the X-axis isreferred to as “X-axis direction”, a direction parallel to the Y-axis isreferred to as “Y-axis direction”, and a direction parallel to theZ-axis is referred to as “Z-axis direction”.

Embodiment 1

Schematic Configuration of Oscillator

FIG. 1 is a schematic plan view showing a schematic configuration of anoscillator 100 according to Embodiment 1. FIG. 2 is a cross-sectionalview taken along the line A-A in FIG. 1. In the oscillator 100 of theembodiment, an electronic component that functions as an oscillator byelectrically connecting with a resonator element and a resonator element20 are included in the same container 10.

First, the schematic configuration of the oscillator 100 according toEmbodiment 1 will be described with reference to FIGS. 1 and 2.

As shown in FIGS. 1 and 2, the oscillator 100 includes an oscillationcircuit 50, the resonator element 20, a varicap capacitor 22, aninductor 24 as one example of an electronic element, and the container10. The container 10 includes a package main body 18 and a lid 19. Thepackage main body 18 is formed in a rectangular box shape in order tocontain the varicap capacitor 22, the inductor 24, the oscillationcircuit 50, and the resonator element 20. The general externaldimensions of the container 10 are 7.0 mm length, 5.0 mm width, and 1.5mm height. In FIG. 1, the lid 19 is shown in a see-through manner forconvenience of description. Although the inductor 24 is illustrated asan electronic element, the electronic element is not limited to theinductor. The electronic element may be a passive element such as aresistor or a capacitor, an active element such as a transistor or adiode, a semiconductor circuit element combining the passive and activeelements together, or the like.

The package main body 18 is composed of: a substrate 14 that forms thebottom (negative Z-axis side) of the package main body 18; a first framebody 15 that forms an accommodating space for the oscillation circuit50, the varicap capacitor 22, and the inductor 24, and a support base ofthe resonator element 20; a second frame body 16 that forms anaccommodating space for the resonator element 20; and a seam ring 17 asa bonding material for the lid 19.

The substrate 14 includes a first surface 14 a on which the oscillationcircuit 50 that is electrically connected to the resonator element 20 isdisposed, and a second surface 14 b opposite to the first surface 14 a.The first surface 14 a of the substrate 14 is provided with wiring 42that is connected with the resonator element 20 and the oscillationcircuit 50 to form an oscillation loop. In the oscillator 100 of theembodiment, the oscillation circuit 50, the resonator element 20, thevaricap capacitor 22, and the inductor 24 are connected by means of thewiring 42, and the oscillation loop is configured to include theoscillation circuit 50, the resonator element 20, and the inductor 24.

The substrate 14 includes a conductor layer 12 between the first surface14 a and the second surface 14 b. Specifically, the substrate 14 iscomposed of a first substrate 11, a second substrate 13, and theconductor layer 12 formed between the first substrate 11 and the secondsubstrate 13. The conductor layer 12 is provided between the firstsurface 14 a as a surface of the second substrate 13 on the positiveZ-axis side, and the second surface 14 b as a surface of the firstsubstrate 11 on the negative Z-axis side.

The conductor layer 12 overlaps, in a plan view, the wiring 42 providedon the first surface 14 a, and a distance in a thickness direction(Z-axis direction) between the wiring 42 and the conductor layer 12 isfrom 0.35 mm to 0.7 mm. The inductor 24 and the resonator element 20that are electrically connected to the wiring 42 overlap the conductorlayer 12 in the plan view. With this configuration, when the oscillator100 is mounted on a mounting board, an influence on the oscillator 100due to a wiring pattern of the mounting board and a component or thelike disposed in the vicinity of the oscillator 100, for example, anelectromagnetic coupling between at least a portion of the wiring 42,the inductor 24, and the resonator element 20 and at least a portion ofthe wiring pattern of the mounting board and the component disposed inthe vicinity of the oscillator 100 is reduced, so that the values ofelectrostatic capacitances formed between the wiring 42 and theconductor layer 12, between the inductor 24 and the conductor layer 12,and between the resonator element 20 and the conductor layer 12 arestabilized. Further, when the oscillator 100 is mounted on the mountingboard, the conductor layer functions also as a shield electrode betweenthe wiring, and the wiring pattern of the mounting board and componentwiring disposed in the vicinity of the oscillator 100. Hence, it ispossible to reduce a frequency variation before and after the mountingof the oscillator 100 on the mounting board. Moreover, since theinductor 24 functions as a so-called extension coil for widening afrequency variable range within which the frequency is adjustable, it ispossible to reduce a variation in the frequency variable range widthbefore and after the mounting of the oscillator 100 on the mountingboard.

The wiring 42 is provided to have an area of from 1.65 mm² to 2.0 mm².When the wiring 42 is provided to have an area of 2.0 mm² or more, theoverlapping area of the wiring 42 and the conductor layer 12 increases,the value of the electrostatic capacitance formed between the wiring 42and the conductor layer 12 increases, and thus the oscillationcharacteristics of the oscillator 100 are deteriorated. Conversely, whenit is intended to provide the wiring 42 with an area of 1.65 mm² orless, it is difficult to provide a land pattern for stably connectingthe inductor 24 or the varicap capacitor 22 on the wiring 42.

The second surface 14 b of the substrate 14 is provided with a pluralityof external connection terminals 54 such as a power supply terminal forapplying a voltage to the oscillation circuit 50, an output terminal foroutputting an oscillation signal output from the oscillation circuit 50,a ground terminal serving as a reference potential of the oscillationcircuit 50, and a control voltage input terminal for applying a controlvoltage to the varicap capacitor 22. The conductor layer 12 iselectrically connected with the ground terminal of the externalconnection terminals 54 by means of internal wiring (not shown).

A material with a relative dielectric constant of from 9 to 10 is usedfor the substrate 14, the first frame body 15, and the second frame body16 that constitute the package main body 18. Ceramic with a relativedielectric constant of from 9 to 10 is used for the material of thesubstrate 14, the distance between the wiring 42 and the conductor layer12 is set to from 0.35 mm to 0.7 mm, and the area of the wiring 42 isset to from 1.65 mm² to 2.0 mm², whereby it is possible to configure thecontainer 10 in which the electrostatic capacitance value between thewiring 42 and the conductor layer 12 is from 0.6 pF to 0.8 pF. As thematerial with a relative dielectric constant of from 9 to 10, forexample, alumina (Al₂O₃) ceramic can be used. Ceramic has high rigidityand a low thermal expansion rate, and therefore, the reliability of theoscillator 100 can be enhanced by using ceramic for the package mainbody 18. Although, in the embodiment, ceramic is used for the packagemain body 18 in the description, an insulating material such as glass orresin, or a composite insulating material of glass and resin may be usedother than ceramic as long as the material has a relative dielectricconstant of from 9 to 10.

The package main body 18 is formed as follow: the first substrate 11,the second substrate 13, the first frame body 15, and the second framebody 16 each of which is obtained by forming a green sheet in apredetermined shape are stacked and sintered; and the seam ring 17 isbrazed to an upper surface (surface on the positive Z-axis side) of thesecond frame body 16 with, for example, silver solder. The green sheetis obtained by, for example, dispersing ceramic powders in apredetermined solution, adding a binder thereto, and forming theresultant kneaded mixture in a sheet shape. As the material of the seamring 17, for example, Kovar (alloy of iron, nickel, and cobalt) can beused.

The package main body 18 includes an opening on the positive Z-axisside. The seam ring 17 that forms the opening of the package main body18 and the lid 19 are sealed using, for example, a resistance weldingmethod (seam welding). As the material of the lid 19, for example, Kovarcan be used. An inert gas atmosphere such as nitrogen or argon or areduced-pressure atmosphere with a lower pressure than the atmosphericpressure is established in the interior of a sealed cavity 31 of thepackage main body 18.

In the embodiment, the package main body 18 including the seam ring 17and the lid 19 are sealed using seam welding for the container 10 in thedescription. However, a method may be employed in which a package mainbody not including the seam ring 17 and a lid including a brazingmaterial are used to be sealed using direct seam welding, or a methodmay be employed in which the brazing material is melted by putting thepackage main body and the lid into a furnace to thereby seal themtogether. Moreover, a material such as glass or resin may be used as thebrazing material.

The oscillation circuit 50 is bonded to the first surface 14 a of thesubstrate 14 via a connection member 48 such as an adhesive. Terminalsof the oscillation circuit 50 and the wiring 42 or the like areelectrically connected via bonding wires 52. As the material of thebonding wire 52, for example, metal such as gold (Au) or aluminum (Al),or an alloy containing the metal as a main component can be used. Theoscillation circuit 50 may be bonded to the first surface 14 a of thesubstrate 14 via bumps formed of a conductive material such as gold (Au)or solder, and may be electrically connected with the wiring 42 or thelike simultaneously with the bonding. Alternatively, the oscillationcircuit 50 may be bonded to the first surface 14 a of the substrate 14via a bonding member such as a conductive adhesive, and may beelectrically connected with the wiring 42 or the like simultaneouslywith the bonding. The varicap capacitor 22 and the inductor 24 areconnected via conductive bonding members such as solder or a conductiveadhesive to land patterns provided in the wiring 42.

The first frame body 15 has a function as a support base to fix theresonator element 20. An inner wall of the first frame body 15 on thecavity 31 side extends into the cavity 31 beyond an inner wall of thesecond frame body 16, and the extending portions, which extend from thenegative X-axis direction, are each provided with an internal electrode44 on the surface on the positive Z-axis side.

The resonator element 20 is bonded and supported to the internalelectrode 44 via the connection member 48 having conductivity. One ofelectrodes of the resonator element 20 is electrically connected withthe internal electrode 44 via the connection member 48, while the otherelectrode of the resonator element 20 is electrically connected with theinternal electrode 44 via a bonding wire 52. The resonator element 20may be bonded and supported to the internal electrode 44 only with theconnection member 48 having conductivity, or the resonator element 20may be bonded and supported to the first frame body 15 via a connectionmember not having conductivity and may be electrically connected withthe internal electrode 44 only via the bonding wire 52.

The internal electrode 44 is electrically connected with the wiring 42via a via hole 46 that is disposed to penetrate from the surface of thefirst frame body 15 on the positive Z-axis side to the surface thereofon the negative Z-axis side. With this configuration, the oscillationcircuit 50 and the resonator element 20 are electrically connected.

As the material of the conductor layer 12, the wiring 42, the internalelectrode 44, and the external connection terminal 54, for example, asilver (Ag) /palladium (Pd) alloy, tungsten (W), or the like can beused. The conductor layer 12, the wiring 42, the internal electrode 44,and the external connection terminal 54 can be formed by metalizing thesurfaces of ceramic as the material of the first substrate 11, thesecond substrate 13, and the first frame body 15 with an Ag/Pd alloy,tungsten, or the like, and then baking the metalized Ag/Pd alloy,tungsten, or the like. Thereafter, plating treatment with metal such asnickel (Ni), gold (Au), or silver (Ag) is applied to the surfaces.

Electrostatic Capacitance Value

Next, the electrostatic capacitance value will be described.

FIG. 3 is a graph showing the relationship between the distance betweenthe wiring 42 and the conductor layer 12 and the electrostaticcapacitance value between the wiring 42 and the conductor layer 12. Thenumerical value on the horizontal axis in FIG. 3 represents the distancebetween the wiring 42 and the conductor layer 12, while the numericalvalue on the vertical axis represents the electrostatic capacitancevalue between the wiring 42 and the conductor layer 12. FIG. 3 shows theresults of obtaining the electrostatic capacitance value between thewiring 42 and the conductor layer 12 (ground terminal) in an oscillatorfabricated using the package main body 18 with the thickness of thesecond substrate 13 in the Z-axis direction, which corresponds to thedistance between the wiring 42 and the conductor layer 12, being as aparameter in the oscillator 100 having the configuration shown in FIGS.1 and 2.

As shown in FIG. 3, when the distance between the wiring 42 and theconductor layer 12 is 0.15 mm, the electrostatic capacitance value isabout 1.1 pF, and when the distance between the wiring 42 and theconductor layer 12 is 0.7 mm or more, the electrostatic capacitancegradually approaches 0.6 pF. It is found from this that even when thedistance between the wiring 42 and the conductor layer 12 is increasedto 0.7 mm or more, the effect of reducing the electrostatic capacitancevalue is small. Moreover, by setting the distance between the wiring 42and the conductor layer 12 to 0.7 mm or less, the oscillator 100 with apredetermined height of 1.5 mm or less can be realized.

Negative Resistance

Here, the negative resistance will be described.

FIGS. 4A and 4B are diagrams showing an oscillation circuit as oneexample for explaining the negative resistance, and the equivalentcircuit of the oscillation circuit. FIG. 4A shows a quartz crystaloscillation circuit using a CMOS inverter. FIG. 4B shows the equivalentcircuit of the quartz crystal oscillation circuit in FIG. 4A.

As shown in FIG. 4A, the oscillation circuit connected to a quartzcrystal resonator Xtal is configured to include a CMOS inverter IC₁,capacitors C_(g) and C_(d), and resistors R_(f) and R_(d). An inputterminal of the CMOS inverter IC₁ is connected to an output terminal ofthe quartz crystal resonator Xtal. The resistor R_(d) (damping resistor)is connected between an output terminal of the CMOS inverter IC₁ and aninput terminal of the quartz crystal resonator Xtal. The resistor R_(f)(feedback resistor) is connected between the input and output terminalsof the CMOS inverter IC₁. The output terminal of the quartz crystalresonator Xtal is connected to one end of the capacitor C_(g), and theother end of the capacitor C_(g) is grounded. The input terminal of thequartz crystal resonator Xtal is connected to one end of the capacitorC_(d), and the other end of the capacitor C_(g) is grounded.

As shown in the equivalent circuit of FIG. 4B, the equivalent circuit ofthe quartz crystal resonator Xtal can be considered as a series circuitof an equivalent resistance R_(e) and an equivalent effective reactanceL_(e) when only an inductive characteristic region to be used in anactual oscillation circuit is considered. A peripheral circuit includingthe CMOS inverter IC₁ as viewed from the quartz crystal resonator Xtalcan be considered as a series circuit of an equivalent input capacitanceC_(L) and a negative resistance −R_(i). In the equivalent circuit, thenegative resistance R_(i) is denoted by “−R_(i)” with the minus signindicating a negative value. That is, “−R_(i)” represents a negativenumerical value.

The oscillator shown in FIG. 4A can continue to oscillate at apredetermined frequency ω under the following relation.the absolute value of the negative resistance |R_(i)|≧the equivalentresistance R_(e)

Moreover, in order to reliably activate the oscillator, the absolutevalue of the negative resistance |R_(i)| needs to be increased toapproximately 3 to 10 times the equivalent resistance R_(e). Thenegative resistance R_(i) is expressed by the following equation.

$\begin{matrix}{{Ri} = \frac{- g_{m}}{~{\omega^{2}C_{g}C_{d}}}} & (1)\end{matrix}$where g_(m) represents the transfer conductance of the CMOS inverterIC₁.

When the distance between the wiring 42 and the conductor layer 12 isreduced to thereby increase the electrostatic capacitance therebetween,a parallel capacitance is equivalently added to the capacitors C_(g) andC_(d) in the oscillation circuit of FIG. 4A. When the parallelcapacitance added to the capacitor C_(g) is a capacitor ΔC_(g), and theparallel capacitance added to the capacitor C_(d) is a capacitor ΔC_(d),the negative resistance R_(i) is expressed by the following equation.

$\begin{matrix}\begin{matrix}{{Ri} = \frac{- g_{m}}{{\omega^{2}\left( {C_{g} + {\Delta\; C_{g}}} \right)}\left( {C_{d} + {\Delta\; C_{d}}} \right)}} \\{= \frac{- g_{m}}{{\omega^{2}C_{g}C_{d}} + {\omega^{2}\left( {{C_{g}\Delta\; C_{d}} + {C_{d}\Delta\; C_{g}} + {\Delta\; C_{g}\Delta\; C_{d}}} \right)}}}\end{matrix} & (2)\end{matrix}$

As is apparent by comparing the equation (1) with the equation (2),since the term (C_(g)ΔC_(d)+C_(d)ΔC_(g)+ΔC_(g)ΔC_(d)) is added to thedenominator of the equation (2), the negative resistance R_(i) decreasesas the electrostatic capacitance between the wiring 42 and the conductorlayer 12 increases. Therefore, the oscillation of the oscillator is notactivated, or it takes time to start the oscillation, so thatoscillation characteristics are deteriorated.

Circuit Configuration

Next, the circuit configuration of the oscillator 100 will be described.

FIG. 5 is a diagram showing the circuit configuration of the oscillator100. As shown in FIG. 5, the oscillator 100 is configured to include theresonator element 20, the oscillation circuit 50, the inductor 24, andvaricap capacitors 22 a and 22 b. The oscillation circuit 50 isconfigured to include a CMOS inverter 60, resistors 72 and 74, andcapacitors and 78. The oscillator 100 of the embodiment is avoltage-controlled quartz crystal oscillator (VCXO). The oscillator 100outputs an oscillation signal at a frequency adjusted in response to acontrol voltage from the outside. The oscillator 100 and the oscillationcircuit 50 may each employ a configuration in which a portion of theseelements is omitted or changed or another element is added to theseelements.

An input terminal of the CMOS inverter 60 is connected to an outputterminal of the resonator element 20 via the wiring 42. An inputterminal of the resonator element 20 is connected to one end of theinductor 24 via the wiring 42. The other end of the inductor 24 and anoutput terminal of the CMOS inverter 60 are connected via the wiring 42and the resistor 74. The resistor 72 (feedback resistor) is connectedbetween the input and output terminals of the CMOS inverter 60. Thisforms the oscillation loop from the output terminal of the resonatorelement 20 through the CMOS inverter 60, the resistor 74, and theinductor 24 to the input terminal of the resonator element 20. Theoscillation circuit 50 configured as described above amplifies, with theCMOS inverter 60 being as an amplifying element, an output signal outputfrom the output terminal of the resonator element 20, and supplies theamplified signal as an input signal from the input terminal of theresonator element 20.

The output terminal of the resonator element 20 is connected to one endof the capacitor 76. The other end of the capacitor 76 is connected to acathode terminal of the varicap capacitor 22 a. The other end of theinductor 24 is connected to one end of the capacitor 78. The other endof the capacitor 78 is connected to a cathode terminal of the varicapcapacitor 22 b. An anode terminal of the varicap capacitor 22 a and ananode terminal of the varicap capacitor 22 b are grounded.

The cathode terminal of the varicap capacitor 22 a and the cathodeterminal of the varicap capacitor 22 b are connected to a VC terminal70. A control voltage is applied from the VC terminal 70 to the cathodeterminals of the varicap capacitors 22 a and 22 b. In response to thevoltage value of the control voltage, the capacitance values of thevaricap capacitors 22 a and 22 b are set, and the frequency of theoscillation signal transmitted from the output terminal of the CMOSinverter 60 is adjusted. The control voltages to be applied to therespective varicap capacitors 22 a and 22 b may be different. Further, aconfiguration including only one of the varicap capacitors 22 a and 22 bmay be employed.

Although, in the embodiment, the CMOS inverter 60 is used as anamplifying element in the description, the amplifying element is notlimited to the CMOS inverter. As the amplifying element, a bipolartransistor, a field-effect transistor (FET), a metal-oxide-semiconductorfield-effect transistor (MOSFET), a thyristor, or the like may be used.

FIG. 6 is a table showing the relationship among the distance betweenthe wiring 42 and the conductor layer 12, oscillation characteristics,and a frequency variable width. FIG. 6 shows the results of evaluationperformed by the inventor on the oscillation characteristics andfrequency variable ranges of oscillators with the distance between thewiring 42 and the conductor layer 12 being as a parameter.

As shown in FIG. 6, when the distance between the wiring 42 and theconductor layer 12 is 0.35 mm or more, a sufficient negative resistanceand favorable oscillation characteristics are obtained. In other words,when the electrostatic capacitance between the wiring 42 and theconductor layer 12 is equal to or less than 0.8 pF, which is the valueof the electrostatic capacitance obtained when the distance between thewiring 42 and the conductor layer 12 is 0.35 mm, a sufficient negativeresistance and favorable oscillation characteristics are obtained.Further, the distance is desirably 0.55 mm or more with which theelectrostatic capacitance gradually approaches 0.6 pF. In other words,the electrostatic capacitance between the wiring 42 and the conductorlayer 12 is desirably equal to or less than 0.67 pF, which is the valueof the electrostatic capacitance obtained when the distance between thewiring 42 and the conductor layer 12 is 0.55 mm. Moreover, when thedistance between the wiring 42 and the conductor layer 12 is 0.25 mm ormore, a desired frequency variable range is obtained. Based on theresults, in the oscillator 100 of the embodiment, the distance betweenthe wiring 42 and the conductor layer 12 is set to 0.35 mm or more, andthe electrostatic capacitance value between the wiring 42 and theconductor layer 12 is set to 0.8 pF or less. With this configuration,the oscillator 100 can secure a negative resistance with which favorableoscillation characteristics can be obtained. Moreover, from the results,also under the condition that the distance between the wiring 42 and theconductor layer is 0.7 mm, the oscillator 100 can obtain a desiredfrequency variable range and secure a negative resistance with whichfavorable oscillation characteristics can be obtained.

Although the oscillator 100 has been illustrated as a voltage-controlledquartz crystal oscillator (VCXO), the type of the resonator element orthe oscillator is not limited to the VCXO. As a resonator element, forexample, a SAW (Surface Acoustic Wave) resonator, an AT-cut quartzcrystal resonator, an SC-cut quartz crystal resonator, a tuningfork-type quartz crystal resonator, another piezoelectric resonator, aMEMS (Micro Electro Mechanical Systems) resonator, or the like may beused.

As the substrate material of the resonator element, piezoelectric singlecrystal such as quartz crystal, lithium tantalate, or lithium niobate, apiezoelectric material such as piezoelectric ceramic including leadzirconate titanate, a silicon semiconductor material, or the like may beused. Further, as a means of exciting the resonator element, excitationusing a piezoelectric effect may be used, or electrostatic driving usingthe Coulomb force may be used.

The type of the oscillator may include a piezoelectric oscillator (suchas a quartz crystal oscillator), a SAW oscillator, a voltage-controlledoscillator (such as a VCXO or a VCSO), a temperature-compensatedoscillator (such as a TCXO), an oven-controlled oscillator (such as anOCXO), a silicon oscillator, and an atom oscillator.

As described above, according to the oscillator 100 according to theembodiment, the following advantageous effects can be obtained.

The oscillator 100 is configured to include the oscillation circuit 50,the resonator element 20, the inductor 24, the varicap capacitor 22, andthe container 10. The substrate 14 of the container 10 is provided withthe conductor layer 12 between the first surface 14 a and the secondsurface 14 b of the substrate 14, and the wiring 42 forming theoscillation loop is provided on the substrate 14 (the first surface 14a). Ceramic with a relative dielectric constant of from 9 to 10 is usedfor the material of the substrate 14, the distance between the wiring 42and the conductor layer 12 is set to from 0.35 mm to 0.7 mm, and thearea of the wiring 42 is set to from 1.65 mm² to 2.0 mm². With thisconfiguration, it is possible to configure the container 10 in which theelectrostatic capacitance value between the wiring 42 and the conductorlayer 12 is from 0.6 pF to 0.8 pF. Since the container 10 in which theelectrostatic capacitance between the wiring 42 forming the oscillationloop and the conductor layer 12 is 0.8 pF or less is used for theoscillator 100, the value of the electrostatic capacitance formedbetween the wiring and the conductor layer is stabilized in theoscillator 100, and thus it is possible to reduce the possibility of areduction in the absolute value of the negative resistance of theoscillation circuit. Therefore, it is possible to reduce the possibilityof a deterioration in the characteristics, for example, oscillationstability of the oscillator. Hence, it is possible to provide theoscillator 100 in which the possibility of a deterioration inoscillation stability is reduced. Moreover, since the substrate 14 inwhich the distance between the wiring 42 and the conductor layer 12 isset to 0.7 mm or less is used for the oscillator 100, it is possible, bycontaining the oscillator 100 in a predetermined height ( 1.5 mm orless), to realize the oscillator 100 with a low profile.

Embodiment 2

An electronic component 200 according to Embodiment 2 differs from theoscillator 100 of Embodiment 1 in that the resonator element 20 shown inEmbodiment 1 is not included in the container. The electronic component200 functions as an oscillator by electrically connecting a resonatorelement outside the container to an external connection terminal 254 ofthe electronic component 200.

FIG. 7 is a schematic plan view showing a schematic configuration of theelectronic component 200 according to Embodiment 2. FIG. 8 is across-sectional view taken along the line C-C in FIG. 7. First, theschematic configuration of the electronic component 200 according toEmbodiment 2 will be described with reference to FIGS. 7 and 8. The sameconstituent portions as those of the oscillator 100 of Embodiment 1 aredenoted by the same reference numerals, and a redundant description isomitted. Moreover, a container 210 is formed of the same material as thecontainer 10 of Embodiment 1, and thus the description of the materialis omitted.

As shown in FIGS. 7 and 8, the electronic component 200 includes anoscillation circuit 50, a varicap capacitor 22, an inductor 24, and thecontainer 210. The container 210 includes a package main body 218 and alid 19. The package main body 218 is formed in a rectangular box shapeto contain the varicap capacitor 22, the inductor 24, and theoscillation circuit 50. In FIG. 7, the lid 19 is shown in a see-throughmanner for convenience of description.

The package main body 218 is composed of: a substrate 214 that forms thebottom (negative Z-axis side) of the package main body 218; a frame body216 that forms an accommodating space for the oscillation circuit 50,the varicap capacitor 22, and the inductor 24; and a seam ring 17 as abonding material for the lid 19.

The substrate 214 includes a first surface 214 a on which theoscillation circuit 50 is disposed, and a second surface 214 b oppositeto the first surface 214 a. The first surface 214 a of the substrate 214is provided with wiring 42 that is connected with the oscillationcircuit 50 and a resonator element via the external connection terminal254 of the electronic component 200, described later, to form anoscillation loop. In the electronic component 200 of the embodiment, theoscillation circuit 50, the resonator element as an external component,the varicap capacitor 22, and the inductor 24 are connected by means ofthe wiring 42, and the oscillation loop is configured to include theoscillation circuit 50, the resonator element as an external component,and the inductor 24.

The substrate 214 includes a conductor layer 212 between the firstsurface 214 a and the second surface 214 b. Specifically, the substrate214 is composed of a first substrate 211, a second substrate 213, andthe conductor layer 212 formed between the first substrate 211 and thesecond substrate 213. The conductor layer 212 is provided between thefirst surface 214 a as a surface of the second substrate 213 on thepositive Z-axis side, and the second surface 214 b as a surface of thefirst substrate 211 on the negative Z-axis side.

The conductor layer 212 overlaps, in a plan view, the wiring 42 providedon the first surface 214 a. A distance in a thickness direction (Z-axisdirection) between the wiring 42 and the conductor layer 212 is from0.35 mm to 0.7 mm. The inductor 24 electrically connected on the wiring42 overlaps the conductor layer 212 in the plan view. With thisconfiguration, when the electronic component 200 is mounted on amounting board, an influence on the electronic component 200 due to thewiring pattern of the mounting board and a component or the likedisposed in the vicinity of the electronic component 200, for example,an electromagnetic coupling between at least a portion of the wiring 42and the inductor 24 and at least a portion of the wiring pattern of themounting board and the component disposed in the vicinity of theelectronic component 200 is reduced, so that the values of theelectrostatic capacitances formed between the wiring 42 and theconductor layer 212 and between the inductor 24 and the conductor layer212 are stabilized. Moreover, when the electronic component 200 ismounted on the mounting board, the conductor layer 212 functions also asa shield electrode between the wiring 42, and the wiring pattern of themounting board and component wiring disposed in the vicinity of theelectronic component 200. Hence, it is possible to reduce a frequencyvariation before and after the mounting of the electronic component 200on the mounting board. The wiring 42 is provided to have an area of from1.65 mm² to 2.0 mm² similarly to Embodiment 1.

The second surface 214 b of the substrate 214 is provided with aplurality of external connection terminals 254 such as a resonatorelement connection terminal for connecting the resonator element, apower supply terminal for applying a voltage to the oscillation circuit50, an output terminal for outputting an oscillation signal output fromthe oscillation circuit 50, a ground terminal serving a referencepotential of the oscillation circuit 50, and a control voltage inputterminal for applying a control voltage to the varicap capacitor 22. Theconductor layer 212 is electrically connected with the ground terminalof the external connection terminals 254 by means of internal wiring(not shown).

In the plurality of external connection terminals 254, the resonatorelement connection terminal for connecting the resonator element iselectrically connected with the wiring 42 via a via hole 246 that isprovided to penetrate from the first surface 214 a to the second surface214 b of the substrate 214. The resonator element is connected to theresonator element connection terminal, so that the resonator element iselectrically connected with the oscillation circuit 50. With thisconfiguration, the oscillation circuit 50 and the inductor 24, which areincluded in the interior of the electronic component 200, and theresonator element as an external component constitute the oscillationloop.

As described above, according to the electronic component 200 accordingto the embodiment, the following advantageous effects can be obtained.

The electronic component 200 is configured to include the oscillationcircuit 50, the inductor 24, the varicap capacitor 22, and the container210. The substrate 214 of the container 210 is provided with theconductor layer 212 between the first surface 214 a and the secondsurface 214 b of the substrate 214. The wiring 42 that forms theoscillation loop with the resonator element being connected to theresonator element connection terminal (the external connection terminal254 ) of the container 210 is provided on the substrate 214 (the firstsurface 214 a). Ceramic with a relative dielectric constant of from 9 to10 is used for the material of the substrate 214, the distance betweenthe wiring 42 and the conductor layer 212 is set to from 0.35 mm to 0.7mm, and the area of the wiring 42 is set to from 1.65 mm² to 2.0 mm².With this configuration, it is possible to configure the container 210in which the electrostatic capacitance value between the wiring 42 andthe conductor layer 212 is from 0.6 pF to 0.8 pF. Further, when theelectronic component 200 is mounted on the mounting board, the conductorlayer 212 functions also as a shield electrode between the wiring 42,and the wiring pattern of the mounting board and the component wiringdisposed in the vicinity of the electronic component 200. The container210 in which the electrostatic capacitance between the conductor layer212 and the wiring 42 that forms the oscillation loop with the resonatorelement being connected to the resonator element connection terminal is0.8 pF or less is used for the electronic component 200. Therefore, thevalue of the electrostatic capacitance formed between the wiring and theconductor layer is stabilized in the electronic component 200, and, forexample, in an oscillator that is configured with the resonator elementbeing connected thereto, it is possible to reduce the possibility of areduction in the absolute value of the negative resistance of theoscillation circuit. Hence, it is possible to provide the electroniccomponent 200 in which the possibility of a deterioration in oscillationstability is reduced.

Electronic Apparatus

Next, electronic apparatuses including the electronic componentaccording to an embodiment of the invention will be described withreference to FIGS. 9 to 11. In the description, examples of using theelectronic component 200 connected with the resonator element are shown.

FIG. 9 is a perspective view showing a schematic configuration of amobile (or notebook) personal computer 1100 as one example of theelectronic apparatus including the electronic component according to oneembodiment of the invention. As shown in FIG. 9, the personal computer1100 is composed of a main body portion 1104 including a keyboard 1102,and a display unit 1106 including a display portion 1000. The displayunit 1106 is rotatably supported to the main body portion 1104 via ahinge structure portion. Into the personal computer 1100, the electroniccomponent 200 is built.

As described above, the mobile (or notebook) personal computer 1100 asone example of the electronic apparatus includes, as a clock source forexample, the electronic component 200 according to one embodiment of theinvention, whereby a stable frequency signal is output from theelectronic component 200 as a clock source to be supplied to the mobilepersonal computer 1100. Therefore, the operational reliability of themobile personal computer 1100 can be improved.

FIG. 10 is a perspective view showing a schematic configuration of amobile phone 1200 (including a PHS) as one example of the electronicapparatus including the electronic component 200 according to oneembodiment of the invention. As shown in FIG. 10, the mobile phone 1200includes a plurality of operation buttons 1202, an earpiece 1204, and amouthpiece 1206. The display portion 1000 is disposed between theoperation buttons 1202 and the earpiece 1204. Into the mobile phone1200, the electronic component 200 is built.

As described above, the mobile phone (including a PHS) 1200 as oneexample of the electronic apparatus includes, as a clock source forexample, the electronic component 200 according to one embodiment of theinvention, whereby a stable frequency signal is output from theelectronic component 200 as a clock source to be supplied to the mobilephone 1200. Therefore, the operational reliability of the mobile phone1200 can be improved.

FIG. 11 is a perspective view showing a schematic configuration of adigital camera 1300 as one example of the electronic apparatus includingthe electronic component 200 according to one embodiment of theinvention. In FIG. 11, connections with external apparatuses are alsoshown in a simplified manner. Here, existing film cameras expose asilver halide photographic film with an optical image of a subject,whereas the digital camera 1300 photoelectrically converts the opticalimage of the subject with an imaging device such as a CCD (ChargeCoupled Device) to generate imaging signals (image signals).

The display portion 1000 is provided on a back surface of a case (body)1302 in the digital camera 1300 and configured to perform display basedon the imaging signals generated by the CCD. The display portion 1000functions as a finder that displays the subject as an electronic image.Moreover, on the front side (the rear side in the drawing) of the case1302, a light receiving unit 1304 including an optical lens (imagingoptical system) and the CCD is provided.

When a photographer confirms the subject image displayed on the displayportion 1000 and presses down a shutter button 1306, imaging signals ofthe CCD at the time are transferred to and stored in a memory 1308. Inthe digital camera 1300, a video signal output terminal 1312 and a datacommunication input/output terminal 1314 are provided on a side surfaceof the case 1302. Then, as shown in the drawing, a television monitor1430 and a personal computer 1440 are connected as necessary to thevideo signal output terminal 1312 and the data communicationinput/output terminal 1314, respectively. Further, the imaging signalsstored in the memory 1308 are output to the television monitor 1430 orthe personal computer 1440 by a predetermined operation. Into thedigital camera 1300, the electronic component 200 is built.

As described above, the digital camera 1300 as one example of theelectronic apparatus includes, as a clock source for example, theelectronic component 200 according to the embodiment of the invention,whereby a stable frequency signal is output from the electroniccomponent 200 as a clock source to be supplied to the digital camera1300. Therefore, the operational reliability of the digital camera 1300can be improved.

In addition to the personal computer 1100 (mobile personal computer) inFIG. 9, the mobile phone 1200 in FIG. 10, and the digital camera 1300 inFIG. 11, the electronic component 200 according to one embodiment of theinvention can be applied to electronic apparatuses such as inkjetejection apparatuses (e.g., inkjet printers), laptop personal computers,tablet personal computers, storage area network apparatuses such asrouters or switches, local area network apparatuses, apparatuses formobile terminal base station, television sets, video camcorders, videorecorders, car navigation systems, real-time clock devices, pagers,electronic notebooks (including those with communication function),electronic dictionaries, calculators, electronic gaming machines, wordprocessors, workstations, videophones, surveillance television monitors,electronic binoculars, POS terminals, medical apparatuses (e.g.electronic thermometers, sphygmomanometers, blood glucose meters,electrocardiogram measuring systems, ultrasonic diagnosis apparatuses,and electronic endoscopes), fishfinders, various types of measuringinstrument, indicators (e.g., indicators used in vehicles, aircraft, andships), flight simulators, head-mounted displays, motion tracing, motiontracking, motion controllers, and PDR (pedestrian dead reckoning).

Moving Object

Next, a moving object including the electronic component according to anembodiment of the invention will be described with reference to FIG. 12.In the description, an example of using the electronic component 200connected with the resonator element is shown.

FIG. 12 is a perspective view schematically showing an automobile 1500as one example of a moving object including the electronic component 200according to one embodiment of the invention.

The electronic component 200 according to the embodiment is mounted inthe automobile 1500. As shown in FIG. 12, in the automobile 1500 as themoving object, an electronic control unit (ECU) 1510 into which theelectronic component 200 is built to control tires is mounted in a carbody. In addition, the electronic component 200 can be widely applied toECUs such as for keyless entry systems, immobilizers, car navigationsystems, car air-conditioners, anti-lock brake systems (ABSs), air bags,tire pressure monitoring systems (TPMSs), engine control, brake systems,battery monitors of hybrid and electric automobiles, and car bodyattitude control systems.

As described above, the automobile 1500 as one example of the movingobject includes, as a clock source for example, the electronic component200 according to one embodiment of the invention, whereby a stablefrequency signal is output from the electronic component 200 as a clocksource to be supplied to at least one of the automobile 1500 and theelectronic control unit 1510. Therefore, the operational reliability ofat least one of the automobile 1500 and the electronic control unit 1510can be improved.

What is claimed is:
 1. An electronic component comprising: anoscillation circuit that is electrically connected to a resonatorelement; and a substrate that includes: wiring, the wiring beingelectrically connected to the resonator element and the oscillationcircuit so as to form an oscillation loop; and a surface on which aplurality of external connection terminals are provided, the pluralityof external connection terminals having a ground terminal connected to aground potential, wherein the substrate includes a conductor layerlocated between the wiring and the surface in a thickness direction ofthe substrate, the conductor layer is electrically connected to theground terminal, the conductor layer overlaps with the wiring in a planview, and a distance between the wiring and the conductor layer in thethickness direction is from 0.35 mm to 0.7 mm.
 2. An electroniccomponent comprising: an oscillation circuit that is electricallyconnected to a resonator element; and a substrate that includes: wiring,the wiring being electrically connected to the resonator element and theoscillation circuit so as to form an oscillation loop; and a surface onwhich a plurality of external connection terminals are provided, theplurality of external connection terminals having a ground terminalconnected to a ground potential, wherein the substrate includes aconductor layer located between the wiring and the surface in athickness direction of the substrate, the conductor layer iselectrically connected to the ground terminal, the conductor layeroverlaps with the wiring in a plan view, and an electrostaticcapacitance value between the wiring and the conductor layer is from 0.6pF to 0.8 pF.
 3. The electronic component according to claim 1, furthercomprising: a frame that is formed on a peripheral of the substrate andthat has top and bottom surfaces, the bottom surface contacting thesubstrate; and an internal electrode that is provided on the top surfaceof the frame and that is electrically connected to the wiring, whereinthe resonator element is bonded to and supported by the internalelectrode, and part of the wiring is located between the bottom surfaceof the frame and the substrate.
 4. The electronic component according toclaim 2, further comprising: a frame that is formed on a peripheral ofthe substrate and that has top and bottom surfaces, the bottom surfacecontacting the substrate; and an internal electrode that is provided onthe top surface of the frame and that is electrically connected to thewiring, wherein the resonator element is bonded to and supported by theinternal electrode, and part of the wiring is located between the bottomsurface of the frame and the substrate.
 5. The electronic componentaccording to claim 1, wherein the substrate has a relative dielectricconstant of from 9 to
 10. 6. The electronic component according to claim2, wherein the substrate has a relative dielectric constant of from 9 to10.
 7. The electronic component according to claim 1, wherein the wiringhas an area of from 1.65 mm² to 2.0 mm².
 8. The electronic componentaccording to claim 2, wherein the wiring has an area of from 1.65 mm² to2.0 mm².
 9. The electronic component according to claim 1, furthercomprising: an electronic element, wherein the electronic element isconnected to the wiring, and the electronic element overlaps with theconductor layer in the plan view.
 10. The electronic component accordingto claim 2, further comprising: an electronic element, wherein theelectronic element is connected to the wiring, and the electronicelement overlaps with the conductor layer in the plan view.
 11. Theelectronic component according to claim 9, wherein the electronicelement is an inductor.
 12. The electronic component according to claim10, wherein the electronic element is an inductor.
 13. An oscillatorcomprising: the electronic component according to claim 1; and theresonator element.
 14. An oscillator comprising: the electroniccomponent according to claim 2; and the resonator element.
 15. Theoscillator according to claim 11, wherein the resonator element overlapswith the conductor layer in the plan view.
 16. The oscillator accordingto claim 12, wherein the resonator element overlaps with the conductorlayer in the plan view.
 17. An electronic apparatus comprising theelectronic component according to claim
 1. 18. An electronic apparatuscomprising the electronic component according to claim
 2. 19. A movingobject comprising the electronic component according to claim
 1. 20. Amoving object comprising the electronic component according to claim 2.